Shikoku Kasei Holdings Corp.

This study suggested application of organic solderability preservative for press-fit technol.The conventional joining method and breath fit joining method are done and estimated structure of water-soluble pre-flux film is discussed.The next-generation organic solderability preservative film characteristics are discussed.The long-term reliability (holding force and contact resistance) is discussed.

Measurements using elementary analysis, differential thermal analysis, IR spectroscopy, and X-ray diffractometry have revealed that the title triazine assumes two crystalline forms α and β. The conversion from α to β proceeds rapidly at 230 °C, whereas the reversal takes place slowly at 60 °C and 95% RH.

The chem. reactivity and the viscoelastic properties of epoxy resins containing the intermol. compound [99741-79-4] of 2,4-diamino-6-vinyl-s-triazine (I) and isocyanuric acid were studied using DTA and torsional braid anal.The intermol. compounds of 2,4-diamino-6-ethyl-s-triazine (II) or melamine and isocyanuric acid were used as the reference of I.The epoxy containing the intermol. compound of I and isocyanuric acid in the presence of imidazole compound cured more rapidly than that of the intermol. compound of II or melamine; but, the glass transition temperatures (T_g) of their cured blends were almost equal.The T_g value of the cured epoxy containing the intermol. compound of II and isocyanuric acid is higher than that of the cured epoxy containing II.The increase of T_g appeared due to the reaction of isocyanuric acid and epoxide.